HCI International 2017
Vancouver, Canada, 9 - 14 July 2017
Vancouver Convention Centre
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4th International Conference on HCI in Business, Government and Organizations

Indicative topics/keywords of the broad spectrum of issues to be addressed:

  • 3D web and virtual worlds
  • Analytics and visualization
  • B2B, B2C, C2C, O2O
  • Business applications for home/leisure context
  • Business dashboards
  • Computer-supported collaboration and decision-making
  • E-leadership
  • Electronic, mobile and ubiquitous commerce
  • Gamification in business
  • Information systems in human resource, accounting, finance, enterprise, healthcare, supply chain, and marketplace
  • Kinetic and gesture based interaction
  • Multi-dimensional information visualizations
  • Negotiation and auction
  • Open innovation
  • Pervasive computing
  • Social media for business
  • Social and collaborative shopping in e-commerce
  • Surface computing, gesture-based computing and multi-touch interaction
  • Technology and branding
  • Technology and gender
  • Voice and conversational interaction
Program Board

Program Chairs:


Fiona Fui-Hoon Nah
Missouri University of Science and Technology, USA


Chuan-Hoo Tan
National University of Singapore, Singapore


Board Members:

  • Miguel Aguirre-Urreta, Texas Tech University, United States
  • Andreas Auinger, University of Applied Sciences Upper Austria, Austria
  • Michel Avital, Copenhagen Business School, Denmark
  • Philipp Brauner, RWTH Aachen University, Germany
  • Hock Chuan Chan, National University of Singapore, Singapore
  • Patrick Chau, University of Hong Kong, Hong Kong
  • Xi Chen, Zhejiang University, P.R. China
  • Christy Cheung, Hong Kong Baptist University, Hong Kong
  • Ben C.F. Choi, University of New South Wales, Australia
  • Constantinos K. Coursaris, Michigan State University, United States
  • Brenda Eschenbrenner, University of Nebraska at Kearney, United States
  • Schubert Foo, Nanyang Technological University, Singapore
  • Ann Fruhling, University of Nebraska at Omaha, United States
  • Nobuyuki Fukawa, Missouri University of Science and Technology, United States
  • Jie Mein Goh, Simon Fraser University, Canada
  • Richard H. Hall, Missouri University of Science and Technology, United States
  • Milena Head, McMaster University, Canada
  • Netta Iivari, University of Oulu, Finland
  • Qiqi Jiang, Tongji University, P.R. China
  • Rajiv Khosla, La Trobe University, Australia
  • Dongming Kim, University of New Brunswick, Canada
  • Harald Kindermann, University of Applied Sciences Upper Austria, Austria
  • Yi-Cheng (Justin) Ku, Fu Jen Catholic University, Taiwan
  • Roderick Lee, Pennsylvania State University Harrisburg, United States
  • Younghwa "Gabe" Lee, Miami University, United States
  • Honglei Li, Northumbria University, United Kingdom
  • Eleanor Loiacono, Worcester Polytechnic Institute, United States
  • Mei Lu, Intel Corporation, United States
  • Randall Minas, University of Hawaii, United States
  • Robbie Nakatsu, Loyola Marymount University, United States
  • Chih-Hung Peng, City University of Hong Kong, Hong Kong
  • David Chee Wei Phang, Fudan University, P.R. China
  • Robin Poston, University of Memphis, United States
  • Lingyun Qiu, Peking University, P.R. China
  • Rene Riedl, University of Applied Sciences, Austria
  • Shu Schiller, Wright State University, United States
  • Norman Shaw, Ryerson University, Canada
  • Austin R. Silva, Sandia National Laboratories, United States
  • Juliana Sutanto, Lancaster University, United Kingdom
  • Chee Wee Tan, Copenhagen Business School, Denmark
  • Horst Treiblmaier, University of Applied Sciences, Austria
  • Wietske Van Osch, Michigan State University, United States
  • Eric Walden, Texas Tech University, United States
  • Deliang Wang, A*STAR, Singapore
  • Dezhi Wu, Southern Utah University, United States
  • I-Chin Wu, Fu-Jen Catholic University, Taiwan
  • Bo Sophia Xiao, University of Hawaii at Manoa, United States
  • Dongming Xu, University of Queensland, Australia
  • Shuang Xu, Lexmark International, Inc., United States
  • Cheng Yi, Tsinghua University, P.R. China
  • Dezhi Yin, University of Missouri-Columbia, United States
  • Jie Yu, Nottingham University, P.R. China

 

 

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